ELECTRONIC COMPONENT PACKAGING SECTION FOR PACKAGING ELECTRONIC COMPONENT, LEAD FRAME, ELECTRONIC DEVICE HAVING THE LEAD FRAME, MANUFACTURING METHOD OF ELECTRONIC COMPONENT PACKAGING SECTION, MANUFACTURING METHOD OF LEAD FRAME, AND MANUFACTURING METHOD OF ELECTRONIC DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an electronic component packaging section having improved adhesiveness between an electronic component such as a thin-film chip and a die pad by a die-bond material (jointing material), to provide a lead frame having improved adhesiveness between an inner lead and a resin mold, and to provide an electronic device having the lead frame.;SOLUTION: The die pad 34 as the electronic component packaging section for packaging the electronic component 122 is not surface-treated, and is in an exposed state. The middle section of the inner lead of the lead frame is also formed in an exposed state.;COPYRIGHT: (C)2009,JPO&INPIT