SEMICONDUCTOR DEVICE, SEMICONDUCTOR CHIP MOUNTING SUBSTRATE, METHODS OF MANUFACTURING THE DEVICE AND SUBSTRATE, ADHESIVE, AND ADHESIVE DOUBLE COATED FILM

摘要

The invention aims at improving the temperature resisting cycle characteristics after mounting and moisture absorption resiting reflow characteristics of a chip-mounted semiconductor, and provides an adhesive which functions as a bonding member (3) to be used when a semiconductor chip (6) is mounted on an organic supporting substrate (4) and which has storage moduli at 25 °C and at 260 °C as measured with a dynamic visco-elasticity measuring instrument of 10-2000 MPa and 3-50 MPa, respectively, a double-coated adhesive film produced therewith, a semiconductor device, an semiconductor chip mounting substrate, and methods of manufacturing these products.