Lead frame for ball grid array, semiconductor device having same and manufacturing method thereof

摘要

A plurality of inner leads extending from the outside to the inside and terminal ball bumps formed along each of the inner leads, wherein the terminal ball bumps are composed of two or more rows in which adjacent columns do not overlap in the longitudinal direction of the inner lead; And the adjacent rows maintain a bonding area therebetween. The bonding region can be plated as needed. The lead frame can be manufactured in high yield without reducing the number of pins. Description of the method of manufacturing the same thing as the semiconductor device using a lead frame is demonstrated below.