Semiconductor integrated circuit device including dummy bonding wires

摘要

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to semiconductor integrated circuit devices for preventing wire shorts due to wire sweeping during molding processes. The problem of short circuits due to wire sweeping limits the length of bonding wires that can be used in semiconductor devices and acts as a factor that hinders the reduction of chip size. Accordingly, the present invention provides a semiconductor integrated circuit device including a dummy bonding wire to solve this problem. Wire sweeping occurs most severely on certain wires where the spacing from adjacent wires is wider than the spacing between the remaining wires. That is, the specific wire is a wire that is more directly exposed to the injection molding resin. The present invention can mitigate wire sweeping by forming a dummy bonding wire in front of this particular wire to mitigate exposure to the molding resin. Alternatively, even when the dummy bonding wire is swept and shorted with the next wire, the dummy bonding wire may be implemented without affecting the function of the device. Therefore, the present invention can greatly reduce the length limit of the bonding wires that can be used, it is possible to use a semiconductor chip reduced in size, and to increase the number of chips per wafer to improve productivity and reduce manufacturing costs There is an advantage.