INTEGRATED CIRCUIT DEVICE PACKAGE, AND WIRE BONDING TYPE INTEGRATED CIRCUIT DEVICE PACKAGE AND FLIP BONDING TYPE INTEGRATED CIRCUIT DEVICE PACKAGE INCLUDING SAME

摘要

A disclosed integrated circuit device package, a wire bonding type integrated circuit device package, and a flip bonding type integrated circuit device package comprise: an integrated circuit device provided with thinness to have a flexible structure which can be bent or stretched; and a flexible film pattern unit composed of a flexible material which can be bent or stretched, and provided to be partially arranged in one surface, the other surface, or both surfaces of the integrated circuit device.;COPYRIGHT KIPO 2016