Method of forming chip bumps of bump chip scale semiconductor package

摘要

A method of forming chip bumps of a bump chip scale semiconductor package, such a package and a chip bump are disclosed. In the bump chip scale semiconductor package produced by the above method, the chip bumps are directly formed on the chip pads of a semiconductor chip. The above chip bumps are used as the signal input and output terminals of the package and are used as surface mounting joints when the chip is mounted to a mother board.