BUMP FORMING METHOD OF BUMP CHIP SCALE SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE, AND BUMP

摘要

PROBLEM TO BE SOLVED: To enable chip bumps to be easily formed by a method wherein a solder ball positioning process through which a solder ball is positioned on a gold tail and a bump reforming process in which a spherical or hemispherical chip bump whose core is the gold tail is formed through a thermally treating means are provided. SOLUTION: A resin coating layer 13 is cured, a rectilinear gold tail 22 exposed above the resin coating layer 13 is bent into a curved gold tail 23 by a coining device 50. A flux 35 is applied onto the bent and curved gold tail 23 for the formation of a Sn/Pb solder ball 28 of prescribed size on the curved gold tail 23. A semiconductor chip 10 on a soldering stage is made to pass through a convectional oven, a conventional oven, or an IR reflow device kept at a temperature of 190 deg.C or above, whereby spherical or hemispherical chip bumps where the curved gold tail 23 are made to serve as cores are reformed.