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CIRCUIT FOR CLAMPING GROUND POTENTIAL IN SEMICONDUCTOR DEVICE
CIRCUIT FOR CLAMPING GROUND POTENTIAL IN SEMICONDUCTOR DEVICE
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机译:半导体设备中接地电位的钳制电路
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摘要
PURPOSE: A clamping circuit is provided to clamp a ground potential supplied for driving a circuit to normally drive the circuit included in a semiconductor device regardless of the bouncing of the ground potential. CONSTITUTION: In a ground potential clamping circuit(500), a chip ground potential(Vss) applied through a chip grounding node(100) is supplied to a bias block(200). When the chip ground potential is bounced, the bias block is turned on for supplying the chip ground potential to the next clamp ground nodes. A reference voltage generating unit(100) generates first/second reference potentials higher/lower than the reference ground potential in response to the activation of a chip selecting signal(/CS). When the potential from the bias block is higher than the first reference potential, the first reference potential is outputted as a clamp ground potential(VSS1). When the potential is lower than the second reference potential, the second reference potential is supplied to an input buffer(600) as the clamp ground potential.
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