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Method and the device in order to form the schedule for wafer processing inside multiple chamber type semiconductor wafer processing tool automatically

机译:在多室型半导体晶片加工工具内自动形成晶片加工时间表的方法和装置

摘要

A method and apparatus for producing schedules for a wafer in a multichamber semiconductor wafer processing tool comprising the steps of providing a trace defining a series of chambers that are visited by a wafer as the wafer is processed by the tool; initializing a sequence generator with a value of a variable defining initial wafer positioning within the tool; generating all successor variables for the initial variable value to produce a series of values of the variable that represent a partial schedule; backtracking through the series of variables to produce further partial schedules; and stopping the backtracking when all possible variable combinations are produced that represent all possible valid schedules for the trace. All the possible schedules are analyzed to determine a schedule that produces the highest throughput of all the schedules.
机译:一种用于在多室半导体晶片处理工具中产生晶片时间表的方法和设备,包括以下步骤:提供限定一系列的腔室的迹线,当该工具对该晶片进行处理时,该腔室被晶片访问。用定义工具中初始晶片位置的变量值初始化序列发生器;为初始变量值生成所有后继变量,以产生代表部分调度的一系列变量值;通过一系列变量回溯以产生进一步的部分进度表;并在产生了所有可能的变量组合(表示跟踪的所有可能有效时间表)时停止回溯。分析所有可能的计划,以确定产生所有计划中最高吞吐量的计划。

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