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Method and apparatus for priority based scheduling of wafer processing within a multiple chamber semiconductor wafer processing tool

机译:用于基于优先级的多腔室半导体晶圆加工工具中晶圆加工调度的方法和设备

摘要

Apparatus and concomitant method for performing priority based scheduling of wafer processing within a multiple chamber semiconductor wafer processing system (cluster tool). The sequencer assigns priority values to the chambers in a cluster tool, then moves wafers from chamber to chamber in accordance with the assigned priorities. The sequencer is capable of determining the amount of time available before a priority move is to be performed and, if time is sufficient, the sequencer performs a non-priority move while waiting. The sequencer also dynamically varies assigned priorities depending upon the availability of chambers in the tool. Lastly, the sequencer prioritizes the chambers based upon the minimum time required for the robot to move the wafers in a particular stage.
机译:用于在多室半导体晶片处理系统(集群工具)中执行基于优先级的晶片处理调度的设​​备和伴随方法。定序器在群集工具中为腔室分配优先级值,然后根据分配的优先级将晶圆从一个腔室移到另一个腔室。定序器能够确定在执行优先级移动之前可用的时间量,如果时间足够,定序器会在等待时执行非优先级移动。定序器还根据工具中腔室的可用性动态地改变分配的优先级。最后,定序器根据机械手在特定阶段移动晶圆所需的最短时间来确定腔室的优先级。

著录项

  • 公开/公告号US5928389A

    专利类型

  • 公开/公告日1999-07-27

    原文格式PDF

  • 申请/专利权人 APPLIED MATERIALS INC.;

    申请/专利号US19960735370

  • 发明设计人 DUSAN JEVTIC;

    申请日1996-10-21

  • 分类号H01L21/77;H01L21/02;

  • 国家 US

  • 入库时间 2022-08-22 02:07:41

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