Semiconductor package structure and semiconductor package structure for heat dissipation plate comprises a heat dissipation plate

摘要

(57) [summary] (modified with) An object of the present invention is to prevent the sealing agent to be full of the heat radiating plate surface, it is held securely cooling area, semiconductor package structure and the semiconductor package of the heat sink with having an effective cooling effect It will provide a structure for heat dissipation plate. A substrate 20 having a first surface and a second surface If, which is provided on the first surface of the substrate, a chip 24 which connects the substrate and electrical, is projecting from the substrate, the exposed portions 30 2 and the upper surface of the groove portion is formed in the outer peripheral edge portion of the upper surface 3 And a 04, and the heat sink 30 for covering the chips provided on the first surface of the substrate becomes by a sealant 32 which covers the portion of the chip and the heat dissipating plate, a heat dissipating plate thereby exposed to the outside without sealing the exposed portion 302.