SEMICONDUCTOR PACKAGE WHICH FIXES A HEAT DISSIPATION PLATE BY EXPOSING A PART OF THE HEAT DISSIPATION PLATE TO THE OUTSIDE

摘要

PURPOSE: A semiconductor package is provided to increases overall package heat dissipation efficiency by injecting a suitable material between a semiconductor chip and a heat dissipation plate.;CONSTITUTION: A semiconductor chip is mounted on a substrate(210). A plurality of external connection terminals(240) is formed on the lower part of the substrate. A heat dissipation plate(250) is arranged on the upper part of the semiconductor chip and comprises a central part and a peripheral part. The central part of the heat dissipation plate is exposed to the outside. A molding part molds the upper part of the substrate. The molding part covers the peripheral part of the heat dissipation plate in order to fix the heat dissipation plate.;COPYRIGHT KIPO 2012