Institute of Microelectronics, Department of Electrical Engineering, National Cheng Kung University, Tainan 70101, TAIWAN,Advanced Optoelectronic Technology Center, National Cheng Kung University, 1 Ta-Hsueh Road, Tainan, Taiwan 70101;
Institute of Microelectronics, Department of Electrical Engineering, National Cheng Kung University, Tainan 70101, TAIWAN,Advanced Optoelectronic Technology Center, National Cheng Kung University, 1 Ta-Hsueh Road, Tainan, Taiwan 70101;
Institute of Microelectronics, Department of Electrical Engineering, National Cheng Kung University, Tainan 70101, TAIWAN,Advanced Optoelectronic Technology Center, National Cheng Kung University, 1 Ta-Hsueh Road, Tainan, Taiwan 70101;
Department of Electronic Engineering, Kun-Shan University, No.949, Da-Wan Road,Yuang-Kuang C;
InGaN; High Power LED; Package; Thermal dissipation; resin; Electroplating;
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