SEMICONDUCTOR PACKAGE HEAT SLUG STRUCTURE FOR THERMAL DISSIPATION CAPABLE OF OBTAINING AN ELECTROMAGNETIC WAVE SHIELDING EFFECT AND A METHOD FOR MANUFACTURING THE SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A semiconductor package heat slug structure for thermal dissipation and a method for manufacturing the semiconductor package are provided to improve a heat dissipation effect by extending the size of an outer heat sink.;CONSTITUTION: A chip bonding pad (5) is electrically connected to an inner lead (6). A semiconductor package heat slug (7) is bonded to die paddles (2). An encapsulation process is performed in order to expose one part of the semiconductor package heat slug. An outer lead (9) is formed so that the semiconductor package heat slug faces upwards. An outside heat sink (10) is combined with the semiconductor package heat slug.;COPYRIGHT KIPO 2013