WIRING STRUCTURE, METHOD FOR MANUFACTURING THE SAME, AND OPTOELECTRONIC DEVICE, ELECTRONIC APPLIANCE

摘要

PROBLEM TO BE SOLVED: To provide a wiring structure in which electrical connection between a lower side conductive layer constituting a part of a laminated body and conductive layers to be electrically connected thereto is suitably realized and to provide a method for manufacturing the same.;SOLUTION: The wiring structure comprises a condenser (20C) consisting of the lower side conductive layer (203), an insulating layer (202) formed thereon and an upper side conductive layer (201) formed thereon, a conductive layer (101) to be electrically connected to the lower side conductive layer and a junction layer (301) disposed on the lower layer side of both lower side conductive layer and conductive layer forming a part of a laminated structure and provided on a substrate (S). The lower side conductive layer and the conductive layer are electrically connected to each other via the junction layer.;COPYRIGHT: (C)2004,JPO