首页> 美国政府科技报告 >Manufacturing Methods and Technology Study Covering Methods for Manufacturing Electronic Modules. Guidelines for Design of Printed Wiring Boards for Mechanized Assembly.
【24h】

Manufacturing Methods and Technology Study Covering Methods for Manufacturing Electronic Modules. Guidelines for Design of Printed Wiring Boards for Mechanized Assembly.

机译:制造方法和技术研究制造电子模块的覆盖方法。机械化装配印刷线路板设计指南。

获取原文

摘要

The handbook sets forth standard practices for the design of printed wiring boards for mechanized assembly of components. Guidelines define the basic design parameters and techniques that are peculiar to the mechanized insertion of discrete components and integrated circuit packages.

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号