Formation device null of the buffer coat for the high Tc tape superconductive conductor which lines up

摘要

PURPOSE: To continuously and efficiently form a buffer layer for an aligned high-Tc tape superconductor by cleaning and polishing a tape substrate, then depositing a strontium titanate layer by evaporation thereon and bombarding the substrate by a laser beam. ;CONSTITUTION: The substrate 4 is delivered from a coil 6 and is degreased by the Freon solvent in a degreasing bath 8. The substrate 4 is then introduced into an electrolytic polishing bath 10 and is subjected to electrolytic polishing and thereafter, the substrate is introduced into an ultrasonic cleaning bath 12 where the substrate 4 is subjected to ultrasonic cleaning with deionized water. The substrate is further ultrasonically cleaned with acetone in an ultrasonic cleaning bath 14 and further ultrasonically cleaned with methanol in an ultrasonic cleaning bath 16. The cleaned substrate 4 is then introduced into a CVD chamber 18 where the strontium titanate layer is deposition by evaporation on the substrate 4 and thereafter, the substrate is bombarded by the laser beam in a laser processing chamber 22 and is cooled in a vacuum cooling chamber 37. The substrate is taken up to form a roll 38. As a result, the buffer layer for the aligned high-Tc tape superconductor is formed on the tape substrates 4.;COPYRIGHT: (C)1994,JPO