Film substrate, semiconductor device, method of manufacturing film substrate, method of manufacturing semiconductor device and method of manufacturing circuit board with semiconductor device

摘要

Disclosed is a film substrate comprising an insulative sheet including a first region to be separated, having a slit on an outer peripheral line of the first region, and on which a semiconductor device chip is to be mounted, and a conductive pattern formed on the insulative sheet, crossing the slit, and to be connected to an external terminal of the semiconductor device chip.