SAWING APPARATUS OF SUBSTRATE FOR SEMICONDUCTOR PACKAGE AND METHOD THEREOF TO IMPROVE SAWING EFFICIENCY

摘要

PURPOSE: A sawing apparatus of a substrate for a semiconductor package and a method thereof are provided to maximize sawing efficiency by using an X-axis and a Y-axis sawing parts. CONSTITUTION: A sawing apparatus of a substrate for a semiconductor package includes an X-axis sawing part, a Y-axis sawing part, and an adsorption part. The X-axis sawing part includes at least one pair of rails for moving a plurality of substrates to an X-axis direction and a plurality of first blades for sawing simultaneously two X-axis lines of each substrate. The Y-axis sawing part(120) includes a plurality of second blades(124) for sawing simultaneously Y-axis lines of each substrate.