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CHUCK TABLE FOR FIXING SEMICONDUCTOR PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE SAWING APPARATUS HAVING THE SAME
CHUCK TABLE FOR FIXING SEMICONDUCTOR PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE SAWING APPARATUS HAVING THE SAME
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机译:用于固定具有相同功能的半导体封装基板和半导体封装锯切装置的卡盘表
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摘要
PURPOSE: A chuck table and a semiconductor cutting package device thereof are provided to remarkably reduce the failure rate of a semiconductor package by spraying highly pressurized cleaning solution towards the different side of a semiconductor package substrate. CONSTITUTION: A blade movement groove(120) compartmentalizes a package adhering part(110) which are formed in the surface side in order to vertically and horizontally cross between a plurality of package adhering parts. A plurality of cleaning liquid injection hole(130) enables the edge of a blade(155) to be passed during a cutting process. A cleaning liquid supply pipe(135) is connected to a plurality of cleaning liquid injection holes and includes a supply port(133) for connecting to a cleaning liquid supply part. A vacuum pipe(145) and the cleaning liquid supply pipe are formed inside a chuck table(100) for fixing a semiconductor package. The chuck table enables the liquid to be sprayed towards the different surface of the semiconductor package substrate through the liquid supply pipe.
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