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APPARATUS AND A METHOD FOR TRANSFERRING A SEMICONDUCTOR PACKAGES IN A SAWING AND A SORTER SYSTEM CAPABLE OF IMPROVING PRODUCTIVITY
APPARATUS AND A METHOD FOR TRANSFERRING A SEMICONDUCTOR PACKAGES IN A SAWING AND A SORTER SYSTEM CAPABLE OF IMPROVING PRODUCTIVITY
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机译:在能够提高生产率的锯切和分拣机系统中转移半导体包装的装置和方法
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摘要
PURPOSE: An apparatus and a method for transferring a semiconductor packages in a sawing and a sorter system are provided to rapidly transfer divided semiconductor packages by using a unit pickers and a chip pickers.;CONSTITUTION: A chuck table(110) supports semiconductor package sets cut by a spindle. A first stage(120) and a second stage(130) support semiconductor packages. Unit pickers(140) transfer one or two sets to the first stage. Chip pickers(160) transfer the semiconductor package sets of the first stage to two regions of the second stage separately.;COPYRIGHT KIPO 2013
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