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A method for processing of oxide - limited vcsel - semiconductor devices
A method for processing of oxide - limited vcsel - semiconductor devices
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机译:一种氧化物受限的vcsel半导体器件的加工方法
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摘要
It is a method for producing a vcsels on a substrate, and indeed by the formation of a first parallel stack of mirrors on the substrate; forming an active and spacer layer on the first parallel mirror stack and the shaping of a second parallel mirror stack on the active and spacer layer. The second parallel mirror stack is then etched, in order to define a structure, and indeed followed by the oxidation of the circumference side walls of the structure for the formation of a current limiting central zone in the structure, and finally, at least a part of the external side of the structure is etched, in order to remove material which has been oxidized.
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