Method for manufacturing semiconductor devices with which chips are structured, tested and isolated on wafer, involves processing fractured wafer and damaged chip with edge portion and breakage outline with limited fragment

摘要

The method involves processing fractured wafer (1) and a damaged chip (2) with an edge portion (11) and a breakage outline (12) with limited fragment (15). The fragment is positioned during processing in such a way that it has the same adjustment as it was still a component of the wafer. An independent claim is also included for a device for processing an edge portion and a fracturing outline for a limited fragment of a wafer.