Sn PLATING OR Sn ALLOY PLATING HAVING EXCELLENT SUPPRESSION OF WHISKER GENERATION

摘要

PROBLEM TO BE SOLVED: To provide an Sn plating or Sn alloy plating structure free from the generation of whiskers, to provide its production method, and particularly, to provide an Sn plating or Sn alloy plating structure where the generation of whiskers is suppressed even when being subjected to external stress such as bending, and to provide its production method.;SOLUTION: The Sn plating or Sn alloy plating is characterized in that an alloy phase of Sn is formed on the grain boundaries of Sn plating or Sn alloy plating, and particularly, an alloy phase of Sn in which the ratio to be occupied in the length of the grain boundaries is ≥50% is formed.;COPYRIGHT: (C)2006,JPO&NCIPI