首页> 中文期刊> 《上海交通大学学报》 >Reliability Analysis of Sn-Bi Plating Chips

Reliability Analysis of Sn-Bi Plating Chips

         

摘要

The character of Sn-Bi plating chips,such as the effect of whisker preventing, solder ability,temperature cycle(T/C) test and thermal humidity bias(THB) test result was introduced.The research result shows that the Sn-Bi plating chips have good effect of prevent whisker from growing,these chips can pass the T/C test and THB test.

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