首页>
外国专利>
Eliminating systematic process yield loss via precision wafer placement alignment
Eliminating systematic process yield loss via precision wafer placement alignment
展开▼
机译:通过精确的晶圆放置对准消除系统的工艺良率损失
展开▼
页面导航
摘要
著录项
相似文献
摘要
A method for a semiconductor process includes correlating yield loss for the performance of a processing step in a semiconductor manufacturing process with the mechanical placement of the semiconductor substrate and, based on the correlation, placing semiconductor substrates in a position with sufficient placement precision to reduce yield loss below a predetermined threshold.
展开▼