Elimination of systematic losses of the process yield due to the precise adjustment of the wafer - placement

摘要

A process for the semiconductor processing workpiece support comprises: correlating a yield loss when performing a process step in a semiconductor manufacturing process with a mechanical positioning of the semiconductor substrate and, on the basis of this correlation, placing of semiconductor substrates in a position with a sufficient positioning precision, in order to yield losses to be reduced below a certain threshold value, during the subsequent carrying out the process step.