Electroless plating apparatus, semiconductor wafer having bumps, semiconductor chip having bumps, methods of manufacturing the semiconductor wafer and the semiconductor chip, semiconductor device, circuit board, and electronic equipment

摘要

An electroless plating apparatus includes: a storage tank for an electroless plating solution; a blocking member which blocks the electroless plating solution from flowing from a treatment side of a semiconductor wafer installed to the storage tank toward an opposite side to the treatment side, the treatment side being a side facing the electroless plating solution; and a solution supplier which causes the electroless plating solution to flow so that the electroless plating solution comes in contact with the treatment side of the semiconductor wafer.