Plasma Etch Process Diagnosis and Control By Wireless Sensor Wafer in Semiconductor Chip Manufacturing

摘要

Plasma etch in semiconductor chip manufacturing is a complex process. The final process performance depends strongly on process parameters and their distributions at the surface of production wafers in an etch chamber. Until recently, there was no known technique that could monitor such critical parameters in-situ at the wafer surface before.In this paper we discuss an innovative technology where novel wireless sensor wafers (PlasmaTemp~TM) are combined with advanced chamber diagnostic modeling techniques (PlasmaRx~TM) to provide a powerful solution-focused system for in-situ etch chamber component health monitoring, questionable component identification, and further corrective action.