Semiconductor wafer, method of manufacturing semiconductor wafer having bumps, semiconductor chip having bumps and method of manufacturing the same, semiconductor device, circuit board, and electronic equipment

摘要

A semiconductor wafer includes a plurality of monolithic integrated circuits formed in a semiconductor crystal for realizing a function of a plurality of semiconductor chips; a plurality of pads formed in a plurality of first regions to be the plurality of semiconductor chips; and a conductor formed in a layer lower than the pads through a second region, which is located between two of the first regions, and electrically connecting at least two of the pads.