An apparatus and method for ultrasonically bonding two or more layers of material and resulting bonding structure

摘要

The disclosure is directed to ultrasonic bonding equipment, in which the anvil (110) and horn (140) include protrusions (111,112,151,152) of varying height to grip the material (210) being bonded. The outer protrusions (111,151) may form smaller or differently shaped indentations in the material (210) to reduce material stresses of the material (210) at the outer region of the material. An exemplary embodiment of an ultrasonic bonding system includes an anvil (110) and a horn (140) arranged facing the anvil to ultrasonically bond a gripped portion of two or more layers of material (210A,210B). The gripped portion of the layers includes an inner region and an outer region. The anvil and the horn apply a gripping force to the outer region that is less than a gripping force applied to the inner region of the gripped materials.