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Temperature Rise at Bonding Parts and Bonding Mechanism of Parallel Gap Bonding Method. Bonding Phenomena and Process Control on Electronic Materials with Fine Size 2nd Report.

机译：平行间隙粘合法的粘接部件温度升高和粘接机构。粘接现象和尺寸第二次报告电子材料的过程控制。

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Shuji Nakata; Young-eui Shin; Tadasi Tsuruzawa;
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年度 1992
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Temperature Rise at Bonding Parts and Bonding Mechanism of Parallel Gap Bonding Method. Bonding Phenomena and Process Control on Electronic Materials with Fine Size 2nd Report.

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