Provided is a method of manufacturing a light emitting diode package having improved light extraction efficiency. A method of manufacturing a light emitting diode package according to the present invention includes the steps of: providing a package substrate having a light emitting diode chip and metal wiring connected to both electrodes of the light emitting diode chip; Forming a resin packaging part in a mounting area of the light emitting diode such that the light emitting diode chip is encapsulated; Depositing a plurality of fine particles selectively degradable with respect to the constituents of the resin packing part on the surface of the resin packing part; And removing the fine particles from the resin packing part so as to roughen the surface of the resin packing part.;Light Emitting Diodes (LEDs), packages, light extraction efficiency, roughness, total reflection
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