PACKAGE STRUCTURE OF LIGHT-EMITTING DIODE CAPABLE OF ENHANCING HEAT DISSIPATION EFFECT AND IMPROVING LIGHT-EMITTING EFFICIENCY, AND METHOD OF MANUFACTURING THE SAME

摘要

PPROBLEM TO BE SOLVED: To provide a package structure of a light-emitting diode capable of enhancing a heat dissipation effect and improving light-emitting efficiency. PSOLUTION: A substrate unit has a substrate body. On the surface of the substrate body, there are provided a first conductive solder pad, a second conductive solder pad, and a solder pad for carrying chips. An alloy unit has a nickel palladium alloy formed on the solder pad for carrying chips. A light-emitting unit has a light-emitting diode chip positioned on a nickel palladium alloy of an alloy unit by already-solidified tin balls and tin paste. A conduction unit has at least two conductive wires. A light-emitting diode chip is electrically connected between the first conductive solder pad and the second conductive solder pad by the at least two conductive wires. A package unit has translucent package colloid that covers the light-emitting unit and the conduction unit by being formed on the surface of the substrate body. PCOPYRIGHT: (C)2011,JPO&INPIT