LIGHT-EMITTING DIODE PACKAGE AND BACKLIGHT UNIT, CAPABLE OF IMPROVING HEAT DISSIPATION EFFICIENCY FURTHER

摘要

PURPOSE: A light-emitting diode package and a backlight unit are provided to improve luminance efficiency, by comprising a thermal conductive layer between a body and a PCB. ;CONSTITUTION: A first pad(104) has a first plane along a first direction and a second plane along a second direction. The second plane is opposite to the first direction. A second pad is electrically separated from the first pad. The second pad has a third plane along the first direction and a fourth plane along the second direction. A molding part(101) fixes the first pad and the second pad. The molding part has a first open aperture(102) and a second open aperture(114). The first open aperture exposes at least a part of the first and the third plane along the first direction. The second open aperture exposes at least a part of the second plane and the fourth plane along the second direction. A light emitting diode chip is placed on the first plane of the first pad, and is electrically connected to the first pad and the second pad. A first lead(106) is electrically connected to the first pad, and is located outside the molding part. A second lead is electrically connected to the second pad, and is separated from the first lead. The second lead is located outside the molding part.;COPYRIGHT KIPO 2011