首页> 外国专利> LIGHT EMITTING DIODE PACKAGE AND A BACKLIGHT UNIT, CAPABLE OF IMPROVING A HEAT EMITTING PROPERTY AND LIGHT EMITTING EFFICIENCY

LIGHT EMITTING DIODE PACKAGE AND A BACKLIGHT UNIT, CAPABLE OF IMPROVING A HEAT EMITTING PROPERTY AND LIGHT EMITTING EFFICIENCY

机译:发光二极管封装和背光单元,能够提高散热性能和发光效率

摘要

PURPOSE: A light emitting diode package and a backlight unit are provided to improve an assembling property and the productivity by omitting separate chassis and bracket for mounting the light emitting package.;CONSTITUTION: A second pad(105) is electrically separated from a first pad(104). A first chip(108) is in electrical connection with the first pad and the second pad. A molding part(101) fixes the first pad and the second pad. A first lead(106) with a first side is in electrical connection with the first pad. A second lead(107) with the second side is in electrical connection with the second pad. The second side is in parallel with the first side.;COPYRIGHT KIPO 2011
机译:目的:提供发光二极管封装和背光单元,以通过省略用于安装发光封装的单独的底盘和支架来提高组装性能和生产率。组成:第二焊盘(105)与第一焊盘电隔离(104)。第一芯片(108)与第一焊盘和第二焊盘电连接。模制部件(101)固定第一垫和第二垫。具有第一侧的第一引线(106)与第一焊盘电连接。具有第二侧的第二引线(107)与第二焊盘电连接。第二面与第一面平行。; COPYRIGHT KIPO 2011

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