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LIGHT EMITTING DIODE PACKAGE AND A BACKLIGHT UNIT, CAPABLE OF IMPROVING A HEAT EMITTING PROPERTY AND LIGHT EMITTING EFFICIENCY
LIGHT EMITTING DIODE PACKAGE AND A BACKLIGHT UNIT, CAPABLE OF IMPROVING A HEAT EMITTING PROPERTY AND LIGHT EMITTING EFFICIENCY
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机译:发光二极管封装和背光单元,能够提高散热性能和发光效率
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摘要
PURPOSE: A light emitting diode package and a backlight unit are provided to improve an assembling property and the productivity by omitting separate chassis and bracket for mounting the light emitting package.;CONSTITUTION: A second pad(105) is electrically separated from a first pad(104). A first chip(108) is in electrical connection with the first pad and the second pad. A molding part(101) fixes the first pad and the second pad. A first lead(106) with a first side is in electrical connection with the first pad. A second lead(107) with the second side is in electrical connection with the second pad. The second side is in parallel with the first side.;COPYRIGHT KIPO 2011
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