首页> 外国专利> LIGHT-EMITTING DIODE PACKAGE IMPROVING THE PHOTONIC EFFICIENCY AND PROTECTION AGAINST HEAT CHARACTERISTIC AND BACKLIGHT UNIT INCLUDING THE SAME AND DISPLAY DEVICE

LIGHT-EMITTING DIODE PACKAGE IMPROVING THE PHOTONIC EFFICIENCY AND PROTECTION AGAINST HEAT CHARACTERISTIC AND BACKLIGHT UNIT INCLUDING THE SAME AND DISPLAY DEVICE

机译:发光二极管封装,提高了热效率和光热效率和保护,包括相同的显示装置和背光单元

摘要

PURPOSE: A light-emitting diode package and backlight unit including the same and cooling fin performing the emission which the display device generates in the light emitting diode of the heat is formed.;CONSTITUTION: The main body(10) of the light-emitting diode package comprises the head unit(20) and body portion(60). The cooling fin(70) locates in the same coplanar as the exterior of the main body. In the side of the head unit, the light emitting surface(24) in which one or more light emitting diode chip(22) is mounted is formed.;COPYRIGHT KIPO 2011
机译:目的:形成一种发光二极管封装和背光单元,包括该发光二极管封装和冷却翅片,该散热鳍片执行显示装置在热量的发光二极管中产生的发光。;构成:发光主体(10)二极管封装包括头部单元(20)和主体部分(60)。散热片(70)与主体的外部位于同一平面。在头单元的侧面,形成有安装有一个以上的发光二极管芯片(22)的发光面(24)。COPYRIGHTKIPO 2011

著录项

  • 公开/公告号KR20100134494A

    专利类型

  • 公开/公告日2010-12-23

    原文格式PDF

  • 申请/专利权人 LG ELECTRONICS INC.;

    申请/专利号KR20090098844

  • 发明设计人 SEO BU WAN;

    申请日2009-10-16

  • 分类号H01L33/64;

  • 国家 KR

  • 入库时间 2022-08-21 17:53:07

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