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LIGHT-EMITTING DIODE PACKAGE IMPROVING THE PHOTONIC EFFICIENCY AND PROTECTION AGAINST HEAT CHARACTERISTIC AND BACKLIGHT UNIT INCLUDING THE SAME AND DISPLAY DEVICE
LIGHT-EMITTING DIODE PACKAGE IMPROVING THE PHOTONIC EFFICIENCY AND PROTECTION AGAINST HEAT CHARACTERISTIC AND BACKLIGHT UNIT INCLUDING THE SAME AND DISPLAY DEVICE
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机译:发光二极管封装,提高了热效率和光热效率和保护,包括相同的显示装置和背光单元
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摘要
PURPOSE: A light-emitting diode package and backlight unit including the same and cooling fin performing the emission which the display device generates in the light emitting diode of the heat is formed.;CONSTITUTION: The main body(10) of the light-emitting diode package comprises the head unit(20) and body portion(60). The cooling fin(70) locates in the same coplanar as the exterior of the main body. In the side of the head unit, the light emitting surface(24) in which one or more light emitting diode chip(22) is mounted is formed.;COPYRIGHT KIPO 2011
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