Chip module with encapsulated chip such as for chip cards encapsulated with a material having two polymer components resistant to different chemical bonds

摘要

The chip module has a substrate (1) and a chip (2) mounted on the substrate. An encapsulation (7) is applied over the chip such that the chip and surface of the substrate are at least partly covered. The encapsulation material is a polymer composition with first and second polymer components chemically covalently bonded. The first component is resistant to a first class of chemically reactive bonds and the second polymer is resistive to a second class. The first and second class have different reactivities. Independent claims also cover a method of encapsulating a chip and the use of an encapsulating material.