Chip module for e.g. smart card, has chip provided on surface of flexible substrate, reinforcement elements provided on surface and interposed between surface and chip, and molding cover encapsulating chip and reinforcement elements

摘要

The module has a chip (20) provided on a surface (11) of a flexible substrate (10), and conductive structures (31) provided on one of the surfaces (11, 12) of the substrate. Reinforcement elements (42) in the form of frame are provided on the surface of the substrate. A molding cover (60) encapsulates the chip and reinforcement elements. The reinforcement elements are interposed between surface of the substrate and the chip and are made of steel. An independent claim is also included for a method for producing a chip module.