Laser processing device and method uses multi-wavelength laser beam focused at different depths in wafer for simultaneous division and wafer dicing

摘要

A laser processing device comprises a unit to modify a region in a wafer (10) by multi-photon absorption in bringing a laser beam (La,Lb) to a focus (Pa,Pb). A light source (Sla) radiates a multi-wavelength beam that is focused by a collecting lens (CV) simultaneously giving many focus points for the different wavelengths and many modified regions (Ga1-3,Gb1-3) spaced in the depth of the wafer along a given dividing line (K). Independent claims are also included for the following: (A) Six processing methods; and (B) Six further laser processing devices as above.