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Hybrid wafer dicing approach using a spatially multi-focused laser beam laser scribing process and plasma etch process
Hybrid wafer dicing approach using a spatially multi-focused laser beam laser scribing process and plasma etch process
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机译:使用空间多聚焦激光束激光划线处理和等离子体蚀刻工艺的混合晶片切割方法
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摘要
Methods of dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. In an example, a method of dicing a semiconductor wafer having a plurality of integrated circuits involves forming a mask above the semiconductor wafer, the mask composed of a layer covering and protecting the integrated circuits. The mask is then patterned with a spatially multi-focused laser beam laser scribing process to provide a patterned mask with gaps, exposing regions of the semiconductor wafer between the integrated circuits. The semiconductor wafer is then plasma etched through the gaps in the patterned mask to singulate the integrated circuits.
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