首页> 外国专利> Chip housing protected against overflow of plastics sealant includes circuit board, as base plate, locating chip(s), with base plate and chip fitted in box, further structural details for overflow spaces, for illumination system

Chip housing protected against overflow of plastics sealant includes circuit board, as base plate, locating chip(s), with base plate and chip fitted in box, further structural details for overflow spaces, for illumination system

机译:防止塑料密封剂溢出的芯片外壳包括电路板(作为基板),定位芯片(将基板和芯片安装在盒子中),更多的溢流空间结构细节,用于照明系统

摘要

Electric lines (23) are located at both sides of base plate (22) and coupled to chip (21). On both sides of box (24) are provided plug points (25) for plug inserts (26). Near plug points are fitted walls (29).There are first bushings (271), formed by plug inserts and points, and second bushings (272), formed by plug inserts and walls. Between each wall and plug points are formed overflow spaces (31) with lower floor than second bushing for overflow plastics sealant inlet. Independent claims are included for luminous module and illumination using such module.
机译:电线(23)位于基板(22)的两侧,并且耦合至芯片(21)。在盒子(24)的两侧都提供了用于插入插件(26)的插入点(25)。靠近插塞点的位置是壁(29)。有一个由插塞和尖端形成的第一衬套(271),和由插塞和壁形成的第二衬套(272)。在每个壁和塞子点之间形成溢流空间(31),溢流空间(31)的底面低于用于溢流塑料密封剂入口的第二衬套。对于发光模块和使用这种模块的照明包括独立权利要求。

著录项

  • 公开/公告号DE202006017047U1

    专利类型

  • 公开/公告日2007-02-22

    原文格式PDF

  • 申请/专利权人 TAIWAN OASIS TECHNOLOGY CO. LTD.;

    申请/专利号DE202006017047U1

  • 发明设计人

    申请日2006-11-08

  • 分类号H01L23/057;H01L23/16;H01L25/13;F21V15/01;

  • 国家 DE

  • 入库时间 2022-08-21 20:29:01

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