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Chip housing protected against overflow of plastics sealant includes circuit board, as base plate, locating chip(s), with base plate and chip fitted in box, further structural details for overflow spaces, for illumination system
Chip housing protected against overflow of plastics sealant includes circuit board, as base plate, locating chip(s), with base plate and chip fitted in box, further structural details for overflow spaces, for illumination system
Electric lines (23) are located at both sides of base plate (22) and coupled to chip (21). On both sides of box (24) are provided plug points (25) for plug inserts (26). Near plug points are fitted walls (29).There are first bushings (271), formed by plug inserts and points, and second bushings (272), formed by plug inserts and walls. Between each wall and plug points are formed overflow spaces (31) with lower floor than second bushing for overflow plastics sealant inlet. Independent claims are included for luminous module and illumination using such module.
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