Circuit arrangement with several chips in housing has at least one top chip mounted on base chip or chips so that base chip does or does not fully support top chip

摘要

The circuit arrangement has several unhoused integrated circuit chips on top of each other in a housing, whereby at least one lower base chip (1) acts as a carrier for at least one top chip (2a,2b,3) mounted above it. The at least one top chip is mounted on the base chip or chips so that the base chip or chips do or does not fully support the at least one top chip. An independent claim is also included for the following: (1) a method of manufacturing an inventive circuit arrangement.