IC chip mounting method for mounting two or more IC chips by sequentially transferring the IC chips sucked onto a first roller to a second roller and mounting the IC chips transferred to the second roller on a traveling base

摘要

The present invention provides an IC chip mounting method for mounting two or more IC chips on a base, including: preparing a wafer by mounting a tape on a face thereof, which is the reverse of the wafer having a mounting surface to be attached to the base, and by dividing the wafer into IC chips by dicing while leaving the tape; sequentially pressing the IC chips on the wafer against a first roller to allow the chips to be sucked onto the first roller; subsequently transferring the IC chips sucked onto the first roller to a second roller; and subsequently mounting the IC chips transferred to the second roller on the traveling base.