首页>
外国专利>
Method of manufacturing a semiconductor device encapsulated for surface mounting
Method of manufacturing a semiconductor device encapsulated for surface mounting
展开▼
机译:制造封装用于表面安装的半导体器件的方法
展开▼
页面导航
摘要
著录项
相似文献
摘要
A method of manufacturing a semiconductor device suitable for surface mounting whereby semiconductor elements are interconnected into a coherent row of semiconductor elements by means of conductive strips such that a connection point of a certain semiconductor element is connected to a connection point of a semiconductor element preceding it in the row by means of a strip, and another connection point of said certain semiconductor element is connected to a connection point of a semiconductor element following it in the row, and the row of semiconductor elements is enveloped in a protective material, and the semiconductor elements are mutually separated into individual semiconductor devices provided with two side faces, each side face having a portion of the strip which is processed into a connection conductor in that an electrically conducting layer is provided on the side faces contacting said portion of the strip.
展开▼