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Nonvolatile memory devices including floating gates formed of silicon nano-crystals and methods of manufacturing the same

机译:包括由硅纳米晶体形成的浮栅的非易失性存储器件及其制造方法

摘要

A memory device includes a gate stack on a substrate. The gate stack is disposed between a source and a drain. The gate stack includes a tunneling film, storage node, and control oxide film. A thickness of the control oxide film is greater than or equal to about 5 nm and less than or equal to about 30 nm. A method of manufacturing a memory device, including a gate stack on a substrate, wherein the gate stack is disposed between a source and a drain, includes: sequentially forming a tunneling film, a first silicon-rich oxide film, and a control oxide film on the substrate, wherein the first silicon-rich oxide film comprises a SiOx film (1.5x1.7); converting the first silicon-rich oxide film into a silicon oxide (SiO2) film comprising silicon nano-crystals; and patterning the control oxide film, the silicon oxide film, and the tunneling film to form the gate stack.
机译:存储器件包括在衬底上的栅堆叠。栅极堆叠设置在源极和漏极之间。栅极堆叠包括隧穿膜,存储节点和控制氧化膜。对照氧化物膜的厚度大于或等于约5nm且小于或等于约30nm。一种制造存储装置的方法,包括在基板上的栅极叠层,其中该栅极叠层设置在源极和漏极之间,该方法包括:依次形成隧道膜,第一富硅氧化膜和控制氧化膜。在衬底上,其中第一富硅氧化物膜包括SiO x 膜(1.5 2 )膜;图案化控制氧化膜,氧化硅膜和隧穿膜以形成栅极叠层。

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