LIGHT-EMITTING ELEMENT WAFER, LIGHT-EMITTING ELEMENT CHIP, BURN-IN METHOD, AND MANUFACTURING METHOD OF LIGHT-EMITTING ELEMENT CHIP

摘要

PROBLEM TO BE SOLVED: To provide a light-emitting element wafer carrying out a burn-in uninfluenced by any outgoing light from each light-emitting element.;SOLUTION: In a light-emitting element wafer 1 provided with: a substrate 11; and a plurality of light-emitting elements 12 and a common terminal 13 which are formed on the substrate 11, the plurality of light-emitting elements 12 are equipped with at least a light-emitting layer 17 and are arranged in the long axis direction of at least the light-emitting layer 17, and are partitioned by grooves 20 from each other, and the length of the groove 20 in the long axis direction is set to be more than a prescribed value L that does not affect any adjacent light-emitting elements 12 by outgoing lights from the light-emitting elements 12.;COPYRIGHT: (C)2009,JPO&INPIT