WAFER, METHOD OF MANUFACTURING TEMPLATE SUBSTRATE FOR SEMICONDUCTOR LIGHT-EMITTING ELEMENT, METHOD OF MANUFACTURING SEMICONDUCTOR LIGHT-EMITTING ELEMENT, METHOD OF MANUFACTURING SEMICONDUCTOR LIGHT-EMITTING ELEMENT SUBSTRATE, TEMPLATE SUBSTRATE FOR SEMICONDUCTOR LIGHT-EMITTING ELEMENT, SEMICONDUCTOR LIGHT-EMITTING ELEMENT SUBSTRATE, AND RESIST COATING METHOD

摘要

PROBLEM TO BE SOLVED: To obtain a semiconductor light-emitting element which prevents deterioration in patterning accuracy during formation of a resist pattern on a wafer surface to have excellent light extraction efficiency.;SOLUTION: A wafer 10 is used as a semiconductor light-emitting element substrate and comprises: in a thin disc-shaped body thereof, an circular arc-shaped outer peripheral portion 11; and a linear flat portion 12 formed at a part of the outer peripheral portion 11. The wafer forms an angle α of 164° or more between the linear flat portion 12 and a tangent line 13 at a joint A between the outer peripheral portion 11 and the flat portion 12.;COPYRIGHT: (C)2012,JPO&INPIT