LEAD, WIRING MEMBER, PACKAGE COMPONENT, METAL COMPONENT WITH RESIN AND RESIN SEALED SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD OF THEM

摘要

PROBLEM TO BE SOLVED: To easily remove resin burrs of a semiconductor device having a lead resin-molded without damaging a resin body covering the lead.;SOLUTION: In the semiconductor device 10, the lead 11 is formed by coating an external surface of a metal thin plate material with a metal coating, and a semiconductor element 12 is fitted. A peripheral portion 15 of the lead 11 is covered with a coating including a purine skeleton. The coating is formed by making functional organic molecules being constituted of the purine skeleton having at an end a functional group with a bonding property to metal, self-organize to the lead 11.;COPYRIGHT: (C)2009,JPO&INPIT