MOLD FOR INJECTION MOLDING, SEMICONDUCTOR PACKAGE MOLDED THEREWITH, AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE

摘要

PPROBLEM TO BE SOLVED: To allow a semiconductor package having a low profile structure to be manufactured with high reliability. PSOLUTION: A mold for injection-molding a semiconductor package includes a fixed mold member 61 and a plurality of movable mold members 62, which respectively have an inner surface capable of defining a mold cavity when closed. The fixed mold member and the movable mold members are closed to define a mold cavity 68 into which a resin is injected for injection-molding a semiconductor package. The fixed mold member or the movable mold members has/have a gate 65 continuous with the inner surface, through which the resin is injected into the mold cavity. The inner surfaces of the plurality of movable mold members have a first mold surface and a second mold surface facing each other and having a gradually decreasing distance toward the gate 65 therebetween. The first mold surface or the second mold surface has a recess at a position in contact with the gate 65. A large gate opening allows the molten resin to be fed into the mold cavity even at a low in-mold pressure, thereby suppressing the occurrence of burrs and achieving stable resin molding. PCOPYRIGHT: (C)2009,JPO&INPIT